The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2026)
- Date
- 2026-10-26
- Location
- San Diego Marriott Mission Valley, San Diego, USA
- Host
- ASME
About this event
InterPACK 2026 brings together the people shaping how electronic and photonic microsystems are packaged, integrated, manufactured, and made reliable in the real world. If your work sits at the intersection of device performance, production constraints, thermal challenges, materials, automation, and system integration, this is the kind of conference where technical depth meets practical problem-solving. About the Event The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems is a focused, in-person gathering for engineers, researchers, manufacturers, and technical leaders working on the next generation of microsystems. The event centers on the full chain of packaging and integration challenges that turn promising components into usable, scalable products. In practice, that means conversations that go well beyond theory. Packaging and integration are where reliability, manufacturability, cost, thermal management, interconnect strategy, assembly methods, and performance targets all collide. InterPACK 2026 creates a venue for digging into those tradeoffs with people who understand the details. The conference is especially relevant for attendees working in advanced manufacturing and robotics, where electronic and photonic microsystems increasingly need to deliver higher precision, smaller footprints, stronger performance, and more dependable operation. Whether you are building tools, designing devices, refining processes, or scaling production, the subject matter is directly tied to real engineering outcomes. Because this is an in-person event, the format supports the kind of technical exchange that is hard to replicate online: live presentations, direct Q&A, hallway conversations, and the chance to compare approaches with peers facing similar constraints. What to Expect Expect a conference environment built around serious technical content. Sessions are likely to focus on the engineering realities of packaging and integrating microsystems, including the methods, materials, workflows, and design considerations that influence performance from prototype through production. You can expect a mix of structured learning and informal exchange, with opportunities to: Hear technical presentations on current challenges and emerging approaches in electronic and photonic microsystems Explore how packaging decisions affect reliability, thermal behavior, signal integrity, manufacturability, and long-term performance Learn from work connected to advanced manufacturing, process development, automation, and system-level integration Discuss practical engineering tradeoffs with other attendees working across research, development, and production settings Make connections with professionals tackling adjacent problems in robotics, microsystems assembly, and high-performance device integration The strongest conferences in this field are valuable not just because of the formal agenda, but because they put specialized people in the same room. You may come for a particular topic and leave with a better understanding of upstream design decisions, downstream production implications, or new ways to think about integration bottlenecks. For attendees in robotics, this is also a useful lens into enabling technologies. As robotic systems demand better sensing, tighter integration, smaller and more capable components, and more robust manufacturing pathways, microsystem packaging becomes a central engineering concern rather than a secondary one. Why Attend If packaging and integration are part of your work, this conference offers a chance to sharpen both your technical perspective and your decision-making. It is a space for understanding not only what is possible, but what is practical, scalable, and reliable when systems move beyond the lab. You should attend if you want to deepen your understanding of how microsystem packaging affects overall product success. That includes questions such as how to improve yield, manage heat, protect delicate components, support optical or electrical performance, streamline assembly, or bridge the gap between design intent and manufacturing reality. Attending in person also gives you access to a level of context you rarely get from papers alone. You can ask follow-up questions, compare implementation approaches, test assumptions with peers, and hear how others are solving issues that often look different in production than they do in theory. For technical teams, InterPACK 2026 can help you return with ideas that are immediately useful: better frameworks for evaluating packaging strategies, a clearer view of current technical directions, and stronger awareness of the manufacturing and integration considerations that shape successful microsystems. Practical Details Location: In person at the San Diego Marriott Mission Valley in San Diego, USA. Being on site matters for an event like this. Technical conferences on packaging and integration are most useful when you can move easily between sessions, continue discussions after presentations, and meet people whose expertise overlaps with your own in unexpected ways. Date and time: Monday, October 26 at 12:00 AM UTC. If you are planning travel, make sure to confirm the local schedule relative to your time zone and build in enough time to check in, review the program, and identify the sessions most relevant to your work. Because the conference is technically focused, it is worth arriving prepared with the questions, design challenges, or manufacturing issues you want to explore. A good way to get the most from InterPACK 2026 is to treat it as both a learning event and a working session. Come ready to listen carefully, take notes on methods and tradeoffs, and start conversations with people whose experience can sharpen your own approach to packaging and integration.
Who should attend
This is for people who care about how electronic and photonic microsystems actually get built, integrated, and scaled. - You work in **electronics, photonics, microsystems, or advanced packaging** and want deeper technical insight into integration challenges that affect performance, reliability, and manufacturability. - You are an **engineer, researcher, or developer** looking to connect design choices with downstream realities such as assembly, thermal constraints, interconnects, testing, or production yield. - You are involved in **advanced manufacturing** and want a clearer view of how process development, automation, materials, and packaging strategy influence successful product outcomes. - You work in **robotics** and need to understand the microsystem technologies that enable better sensing, tighter integration, smaller form factors, and more dependable field performance. - You lead or support **R&D, prototyping, or productization** and want exposure to practical approaches that can help move devices from concept to robust implementation. - You value being in a room with other technical professionals where you can ask detailed questions, compare methods, and leave with ideas that are directly relevant to your current work.